Monitoring at TMLs in volume

Inductosense ultrasonic thickness sensors can be installed across high volumes of thickness measurement locations (TMLs) on an asset.

Overview

Managing high volumes of TMLs can be a significant challenge for inspectors.

Single point, manual UT is limited for this application. A specialist inspector is required to manually apply coupling gel and then probe the outer surface of a structure. This process can take a significant time simply to acquire one thickness measurement. In addition, this process is prone to human error, resulting in unreliable data.

Moreover, fully automated, wireless, permanently installed monitoring systems (PIMS) have a high unit cost, making them nonviable for high volumes of TMLs

Inductosense sensors are ideal for high volume deployment…

The WAND system has been designed to overcome the limitations of manual UT and the costs associated with fully wireless PIMS.

Inductosense ultrasonic thickness sensors can be installed quickly and efficiently to TMLs. They are simply attached to the structure using adhesive. Then, thickness measurements can be acquired easily using the WAND handheld data collector, where a measurement can be acquired wirelessly in a matter of seconds. Each thickness measurement is generated from the exact same location every time, providing highly accurate, repeatable measurements, free of human error.

Furthermore, the sensors have a low unit cost, compared with fully automated, wireless PIMS sensors. This makes them ideal for high volume deployment across an asset, resulting in long term cost savings.